Through Holes

Besides the technology already described with copper or steel tubes, we develop SuperPlate where the cooling medium flows through deep holes. The heatsink is entirely made of aluminium and the cooling water flows through a circuit consisting in holes drilled in the plate. If this technology can be adopted, we would suggest to put a mechanical filtration unit to protect the moving parts from damages caused by possible residual burrs due to the drilling process. Through holes technology has to be used if components under voltage are mounted on the plate. Using this technology both water cooled plate sides will have equivalent thermal features

Through Holes SuperPlate 150x150x20 mm

Thermal results Power modules mounted on   1 side 2 sides Waterflow Q 10 L/min 10 L/min Power dissipation Pd 2500 W 2500 W Tin water Ti 16°C 16°C Tout water Tu 19,2°C 19,6°C Tsurface max Ts 54°C 47°C Thermal resistance Rth 0,0150 0,0120 Plate thickness: 20 mm

Through Holes SuperPlate 190x140x25 mm

Thermal results Power modules mounted on   1 side 2 sides Waterflow Q 10 L/min 10 L/min Power dissipation Pd 1800 W 1800 W Tin water Ti 16°C 16°C Tout water Tu 19,2°C 19,2°C Tsurface max Ts 36°C 33°C Thermal resistance Rth 0,0110 0,0094 Plate thickness: 25 mm